An Introduction to 3D SPI2 (Spatial Packaging of Interconnected Systems with Physics Interactions) Design Problems: A Review of Related Work, Existing Gaps, Challenges, and Opportunities

by Peddada, Satya R T, Zeidner, Lawrence E, James, Kai A and Allison, James T
Reference:
Satya R T Peddada, Lawrence E Zeidner, Kai A James, James T Allison, "An Introduction to 3D SPI2 (Spatial Packaging of Interconnected Systems with Physics Interactions) Design Problems: A Review of Related Work, Existing Gaps, Challenges, and Opportunities", in ASME 2021 International Design Engineering Technical Conferences [To appear].
Bibtex Entry:
@Inproceedings{Peddada2021b,
  Title                    = {An Introduction to 3D SPI2 (Spatial Packaging of Interconnected Systems with Physics Interactions)  Design Problems: A Review of Related Work, Existing Gaps, Challenges, and Opportunities},
  Address                  = {Virtual, Online},
  Author                   = {Peddada, Satya R T and Zeidner, Lawrence E and James, Kai A and Allison, James T},
  Booktitle                = {ASME 2021 International Design Engineering Technical Conferences [To appear]},
  Date                     = {17-20},
  Month                    = aug,
  Year                     = {2021},
  % Number                   = {DETC2021-22695},
  % Pages                    = {V11BT11A032},
  % Doi                      = {https://doi.org/10.1115/DETC2020-22695},
  Pdf                      = {/publications/Peddada_2021b.pdf},
  % ESDLnote                 =  {<b>Nominated for DAC Best Paper Award</b>},
  Esdlid                   = {C76},
}